Kuna kashe dubban sa'o'i da miliyoyin daloli don tsara tsarin gine-ginen siliki mara lahani, amma idan gidaje na zahiri ya gaza, gabaɗayan ɓangaren ba shi da amfani. Shamaki tsakanin kwakwalwar lantarki mai aiki da guntun siliki da aka goge shine rufewa. Wannan cikakken jagorar ya rushe hadadden duniyar marufi na lantarki na zamani. Ya cancanci karantawa saboda fahimtar takamaiman kayan aiki, haɓakar zafi, da matsalolin injina da ke cikin kare silicon zai inganta haɓakar samar da ku sosai. Ko kuna sarrafa layin taro mai girma ko kuma kuna samun ingantattun kayan aikin don injin gyare-gyaren da kansu, ƙwarewar waɗannan mahimman ra'ayoyin zai cece ku lokaci, rage tarkace mai tsada, da ba ku babban gasa a kasuwa.
Menene fakitin ic kuma me yasa encapsulation ke da mahimmanci a masana'antar semiconductor?
A asalinsa, an ic kunshin shi ne sulke na kariya wanda ke kewaye da guntun siliki mai rauni. Ba tare da wannan mahimmancin kariya mai kariya ba, danda guntu nan take zai faɗa cikin haɗari na muhalli kamar danshi, ƙura, da tasirin jiki. Manufar farko ta encapsulation shi ne a rufe gaba ɗaya m tsarin na ciki daga waje duniya. Wannan yana ba da tabbacin cewa sashin zai yi aiki da dogaro na tsawon shekaru, ko an shigar dashi a cikin dakin uwar garken da ke sarrafa yanayi ko kuma ƙarƙashin murfin mota mai girgiza.
A cikin duniya semiconductor masana'antu, Gidajen jiki kuma yana aiki azaman gada mai mahimmanci. Yana jujjuya wuraren haɗin microscopic akan silicon zuwa mafi girma, daidaitaccen sawun ƙafa wanda za'a iya siyar dashi a zahiri. pcb (Buguwar allon kewayawa). Wannan yana nufin zaɓaɓɓu nau'in kunshin kai tsaye yana faɗin yadda ɓangaren ke haɗawa cikin samfurin ƙarshe. Gidan da ba a zaɓa ba zai iya haifar da zafi fiye da kima, lalata sigina, ko gazawar injina yayin daidaitaccen aiki.
The fasahar kere kere bayan wannan tsari yana da ban mamaki. Muna ɗaukar wani abu mai rauni kamar harsashi na kwai kuma muna saka shi a cikin kayan roba masu wuyar dutse. A yau, mafi yawan abubuwan da kuke gani akan allo sune shimfidar wuri na'urori. Ko ana mu'amala da mai sauki smd bangaren ko hadadden na'ura mai sarrafa nau'i-nau'i iri-iri, ainihin ƙa'ida ɗaya ta shafi: harsashi na waje dole ne ya zama cikakke.
Ta yaya tsarin marufi ke kare guntu mai laushi daga lalacewa?
Tafiya daga silikon siliki zuwa ƙare, samfurin da za a iya hawa yana da rikitarwa sosai. Na zamani tsarin masana'antu yana amfani da dabaru iri-iri na zamani don tabbatar da cikakken aminci. Daya daga cikin mafi mahimmanci tafiyar matakai marufi ya haɗa da kafa hanyoyin haɗin lantarki kafin rufewar ƙarshe ta auku. Misali, a cikin ci gaba jefa-guntu taro, wurin aiki na siliki yana jujjuya shi sama. Yana haɗa kai tsaye zuwa tsarin da ke ƙasa ta amfani da ƙananan ƙullun ƙarfe.
Wannan takamaiman juya guntu kusanci sosai yana rage nisan siginar lantarki dole ne ya yi tafiya. Yana ba da kyakkyawan aikin lantarki. Duk da haka, wadannan microscopic solder bumps na buƙatar babban kariya. Da zarar da haɗin kai An yi nasara cikin nasara, dole ne a kulle taron gabaɗaya a wuri. Kayan kariya yana gudana a kusa da waɗannan ƙananan haɗin gwiwa, suna ba da goyon bayan injiniyoyi masu tsauri da kuma hana su daga fashewa a cikin damuwa.
Samun wannan matakin daidai yana buƙatar ingantaccen kayan aiki na zahiri. Tushen ƙarfe da aka yi amfani da su don siffanta harsashi mai kariya na ƙarshe dole ne a ƙera su zuwa madaidaicin haƙuri. Lokacin ƙirƙirar waɗannan gyare-gyaren ƙarfe masu nauyi, masu yin kayan aiki sun dogara da babban aikiCarbide Drills don yanke tashoshi masu sanyaya a tsaftace da tashoshin injector ba tare da barin bursu ba wanda zai iya tarwatsa kwararar ruwa na robobin kariya.
Menene sinadarin Epoxy mold kuma me yasa ake amfani dashi ko'ina?
Lokacin da muke magana game da jikin filastik baƙar fata na daidaitaccen microchip, kusan koyaushe muna magana ne game da wani epoxy mold. Wannan abu na musamman ne thermoset filastik. Ba kamar robobi na yau da kullun waɗanda za'a iya narkar da su a sake fasalin su ba, ma'aunin zafi da sanyio yana fuskantar wani nau'in sinadari wanda ba zai iya jujjuyawa ba idan ya yi zafi. Da zarar ya warke, sai ya samar da harsashi mai wuyar gaske, mai ɗorewa, da dindindin.
An epoxy mold fili (wanda aka fi sani da emc) shine ainihin hadaddiyar giyar sinadarai da aka yi amfani da ita sosai. Ya ƙunshi resin epoxy na tushe, abubuwan taurara, da ɗimbin adadin silica filler. Silica yana da mahimmanci saboda yana rage girman haɓakar kayan lokacin da aka fallasa zuwa zafi. Wadannan emcs wakiltar cikakken kashin baya na zamani filastik bangaren gidaje. The kayan amfani dole ne kuma ya mallaki kyau kwarai dielectric kaddarorin, tabbatar da cewa suna aiki azaman insulators na lantarki don hana gajerun da'irori na ciki.
“Daidaitawar ku yin gyare-gyare abu kai tsaye yana nuna daidaiton samfurin ku na ƙarshe. A cikin manyan masana'antu, tsinkaya shine riba."
Ta yaya mahaɗar gyare-gyaren ke mu'amala da mahaɗar da kuma haɗin kai?
A lokacin ainihin lokacin allura, zafi, danko gyare-gyaren fili ana tilastawa cikin rami na karfe ƙarƙashin babban matsi. Dole ne ya gudana a hankali a kan siliki mai laushi da abin da ke ciki substrate. Wannan tsari ne na tashin hankali. Idan ba'a iya sarrafa motsin ruwa daidai ba, ruwan da ke gudu zai iya share ƙananan wayoyi na gwal waɗanda ke haifar da haɗin kai.
Bugu da ƙari kuma, ruwan dole ne ya cika kowane ƙananan ƙananan ƙwayoyin cuta rami cikin mold. Duk wani iskar da aka kama yana haifar da wofi. Wuta guda ɗaya ana ɗaukar bala'i lahani. Idan danshi ya taru a cikin fanko, zafin madaidaicin tanda mai sake fitarwa zai juyar da danshin zuwa tururi, a zahiri yana busa bangaren ban da ciki (wanda aka sani da "sakamakon popcorn").
Don hana wannan, da dubawa tsakanin robobin kariya da firam ɗin gubar ƙarfe dole ne ya kasance mai ƙarfi ta hanyar sinadarai. Dace substrate zane yana taka rawar gani sosai a nan. Injiniyoyi sukan tsara fasalin haɗin kai na zahiri ko kuma amfani da ƙwararrun masu tallata mannewar sinadarai don tabbatar da cewa filastik ɗin ya kama ƙarfe ba tare da aibu ba.
Wace rawa wafer ke takawa kafin waƙa?
A tarihi, an yanka siliki cikin guda ɗaya kafin a haɗa shi. Duk da haka, don ƙara yawan aiki da kuma inganta sawun sawun, masana'antar ta bunkasa wafer-matakin marufi. A cikin wannan ci-gaban dabarar, ana sarrafa dukkan fayafan siliki na zagaye da kuma rufe shi lokaci guda kafin wani yanke.
A wannan mataki, wani Layer na kayan kariya yana rufe dukkan saman saman diski mara karye. Sai kawai bayan Layer na kariya ya warke sosai yana aiwatar da aikin kadaici fara. Singulation shine mugun aikin inji na yanka babban diski mai hatimi cikin dubunnan mutane, abubuwan ƙarshe.
Wannan tsarin yankan yana da wuyar gaske saboda dole ne a yanke ruwan siliki mai wuya da filastik mai cike da silica a lokaci guda. Yana buƙatar ƙaƙƙarfan ƙaƙƙarfan ƙaƙƙarfan kayan aikin yankan. Kamar yadda mashin ɗin ke amfani da na musamman Tungsten Carbide Rods don jure lalacewa a kan bene na CNC, igiyoyin dicing dole ne su yi tsayayya da matsananciyar gogayya don hana tsinke gefuna masu laushi na sabbin abubuwan da aka kafa.
Ta yaya tsarin kamar LPKF tuki Laser aiki da ƙirƙira gaba?
Kamar yadda bukatar matsananci miniaturization tsiro, gargajiya inji yankan saws suna kai ga cikakken jiki iyaka. Lokacin da kuke gina abubuwan haɗin kai don smartwatches ko kayan aikin likita, injin injin yana da kauri sosai kuma yana da ƙarfi sosai. Wannan shi ne inda na'urorin Laser na ci gaba, kamar waɗanda suka fara aiki lpkf, shiga don canza tsarin aiki.
sarrafa Laser yanzu wani muhimmin bangare ne na zamani ƙirƙira. Maimakon niƙa ta cikin kayan, high-powered Laser nan take vaporize da epoxy mold fili da silikon da ke ƙarƙashinsa. Wannan tsaftataccen tsarin zubar da ciki yana barin gefuna masu santsi mai ban sha'awa kuma yana ba da damar tazara mai yawa tsakanin abubuwan da ke kan layin samarwa.
Wannan mai girma ci gaba yana nufin cewa ana iya yanke sassa da siffa tare da madaidaicin ƴan kaɗan µm (micrometers). Ta hanyar haɗa ci-gaba na Laser ablation tare da na gargajiya lithography, manufacturers can create highly complex, three-dimensional package shapes that were physically impossible to produce just a decade ago.
Me yasa vias da ci-gaba da zirga-zirga ke da mahimmanci ga manyan ICs?
Na'urori na zamani ba kawai murabba'i guda ɗaya ba ne; suna da hadaddun, manyan gine-ginen bayanai masu tarin yawa. Yayin da muke tattara ƙarin ayyuka cikin sarari guda, da hanya na siginar lantarki ya zama babban ƙalubale na geometric. Hanyoyin ciki dole ne su kasance gajere mai ban mamaki don kiyaye saurin gudu da rage amfani da wutar lantarki.
Don cimma wannan, injiniyoyi suna amfani da ƙananan ramukan da aka haƙa a tsaye da ake kira ta hanyar. Waɗannan ƙananan ƙananan ramukan an lulluɓe su da a m karfe, yawanci ku (Copper), don haɗa nau'ikan yadudduka daban-daban na substrate ko na ciki Layer sake rarrabawa. The rdl da gaske tsarin babbar hanya ce mara ƙayyadaddun ƙayyadaddun ƙayyadaddun ƙayyadaddun hanyoyin haɗin kai akan silicon mutu zuwa manyan ƙwallayen siyar da ke waje.
Wannan babban yawa layout wata cikakkiyar larura ce ga kwamfuta na zamani. Wani lokaci, etching na al'ada na al'ada ba zai iya cimma layukan da suka dace ba. A cikin wadannan lokuta, ƙari Ana amfani da fasahohin masana'antu don haɓaka ainihin alamun tagulla da ake buƙata a hankali.
- Ƙididdiga mafi girma: Ƙarin hadaddun kwakwalwan kwamfuta suna buƙatar ƙarin haɗi.
- Gajerun Hanyoyi na Sigina: Haɗin kai tsaye yana rage jinkirin sigina.
- Rage Sawun Sawun: Layering yana ba da damar ƙaramin girman na'urar gabaɗaya.
Menene ƙalubalen da ke tattare da faɗaɗa yanayin zafi da yaƙi yayin gyare-gyare?
Heat shine babban abokin gaba na madaidaicin masana'anta. A lokacin babban yanayin warkewa, duk kayan suna faɗaɗa. Matsala mai tsanani ta taso saboda akwai mai yawa rashin daidaituwa a cikin thermal fadadawa ƙimar da ke tsakanin siliki mai tsafta ta mutu, firam ɗin gubar tagulla, da harsashi na filastik.
Muna auna wannan fadada ta amfani da coefficient na thermal fadadawa (ko cte). Idan CTE ba a daidaita shi a hankali ba, taron duka zai yi murgudawa yayin da yake yin sanyi zuwa yanayin zafi. A zahiri yana ruku'u kamar guntun dankalin turawa. Wannan yaki babban mafarki ne ga taron hukumar. Idan bangaren ba daidai ba ne lebur, da solder hadin gwiwa zai gaza a lokacin smt (fasahar dutsen saman ƙasa) tsarin haɗe-haɗe.
Don magance wannan, injiniyoyi suna amfani da nagartaccen tsari kayan aikin ƙira software don kwaikwayi matsalolin zafi kafin na zahiri samfuri an taba ginawa. Suna daidaita abun cikin filler silica a hankali a cikin epoxy mold don tabbatar da cewa CTE ɗin ta ta yi daidai da na hukumar da ke ƙasa. Yana da wani m daidaita aikin chemistry da physics.
Standard marufi dabaru ne gaba daya m ga matsananci buƙatun na 5g ku sadarwa da ci-gaba na radar tsarin. A waɗannan mitoci masu tsayi, gidaje na zahiri da kansu na iya tsoma baki tare da siginar rediyo. Dole ne mu ci gaba da bin sawu ingantaccen aiki ta hanyar amfani da kayan aiki na musamman.
Za a high-mita firikwensin ko eriya, da kayan lantarki na gyare-gyaren fili ana bincike sosai. Idan kayan yana ɗaukar ƙarfin lantarki da yawa, siginar ya mutu. Don haka, an ƙirƙira resins na musamman masu ƙarancin asara musamman don barin waɗannan sigina masu sauri su wuce ba tare da lalacewa ba.
Bugu da ƙari kuma, muna ganin tashin na ci gaba ic gine-gine. Concepts kamar iri-iri hadewa da kunshin-kan-kunshi ba da damar ɓangarorin na musamman daban-daban-kamar ƙwaƙwalwar ajiya da dabaru na sarrafawa—a tattara su a tsaye. Wannan yana kiyaye hanyoyin siginar gajarta sosai, yana haɓaka gabaɗaya lantarki da aikin thermal. Lokacin da daidaito ya shafi, yin amfani da kayan aiki masu inganci kamar aSau uku-Blade (3-Flute) Ƙarshen Mill yana tabbatar da na'urorin gwajin da ke riƙe waɗannan na'urori masu sauri suna da kyau daidai kuma suna da gaskiya.
Shin ingantaccen thermoset na polymer zai iya hana lalata da lahani da gaske?
Lallai. Babban abin da ya fi karewa daga mugun yanayi na zahirin zahirin zahirin gaskiya shine amincin abubuwan polymer harsashi. Ko yana da sauki mai hankali ikon transistor ko hadaddun sosai quad flat babu jagora (qfn) microcontroller, maƙasudin maƙasudin shine shiga cikin sifili. Turin ruwa shine babban dalilin ciki lalata da gazawar da ba a kai ba a cikin kayan lantarki da aka tura.
Don cimma wannan cikakkiyar hatimi a ciki samar da girma mai girma, masana'antun suna zaɓar hanyoyi daban-daban dangane da tsananin bukatun aikace-aikace. Gyaran ruwa za a iya amfani da shi don ƙaƙƙarfan ƙaƙƙarfan majalisu na bakin ciki inda ƙananan matsa lamba ya zama tilas don hana share waya. Akasin haka, m matsawa yin gyare-gyare sau da yawa ana fifita don manyan, fale-falen fale-falen fale-falen saboda yana ba da ingantaccen daidaituwa da babban kayan aiki.
Kowane mataki guda a cikin zane da masana'antu lokaci yana buƙatar tsauri hanya. Akwai ko da yaushe a ciniki tsakanin farashi, gudu, da cikakken abin dogaro. Koyaya, ta hanyar buƙatar tsauraran abubuwan sarrafawa da amfani m mafita, masana'antar na ci gaba da samar da biliyoyin na'urori marasa aibu a kowace shekara. The dacewa na kayan amfani da ic ƙirƙira a ƙarshe yana ƙayyade tsawon rayuwar fasahar da muke dogara da ita yau da kullun.
Takaitacciyar Mahimman Hanyoyin Ci Gaba:
- The ic kunshin yana ba da kariya mai mahimmanci ta jiki da mahimmancin hanyar lantarki don siliki mai rauni.
- Epoxy mold fili yana aiki azaman kariya ta farko daga danshi, girgiza, da ciki lalata.
- Na ci gaba tafiyar matakai marufi bukatar pristine haɗin kai mutunci don tabbatar da karfi kayan lantarki.
- Gudanar da thermal fadadawa (cte) yana da mahimmanci don hanawa yaki kuma tabbatar da cikakke smt hawan allo.
- Biyan high-yi in 5g ku aikace-aikace sun dogara gaba ɗaya akan inganta duka biyun kunshin zane da takamaiman yin gyare-gyare ilmin sunadarai.
- Nasara taro da gwaji ya dogara da madaidaicin kayan aiki, tsananin iko mai ƙarfi, da ci gaba ic fasaha.
- Daga gargajiya juya guntu kayayyaki zuwa zamani iri-iri tari, da m na kunshin yi yana fitar da duk masana'antar fasaha gaba.
- A semiconductor ba zai iya aiki a cikin ainihin duniya ba tare da ingantaccen injiniyanci ba, kwanciyar hankali na thermal filastik gidaje.
