Iwe unopedza zviuru zvemaawa uye mamirioni emadhora kugadzira isina chikanganiso chesilicon yekuvaka, asi kana imba yenyama ikatadza, chikamu chose hachina basa. Chipinganidzo pakati pehuropi hwemagetsi hunoshanda uye chidimbu chesilicon yakaraswa ndiyo encapsulation. Iyi dhairekitori yakazara inopwanya nyika yakaoma yemazuva ano emagetsi kurongedza. Zvakakodzera kuverenga nekuti kunzwisisa izvo chaizvo zvekushandisa, zvinopisa simba, uye mechaniki kushushikana kunobatanidzwa mukudzivirira silicon kuchavandudza zvakanyanya goho rako rekugadzira. Kunyangwe iwe uri kutonga yakakwira-vhoriyamu mutsara wegungano kana kutsvaga maturusi chaiwo emuchina iwo mold pachawo, kugona aya akakosha pfungwa kunokuchengetedza nguva, kuderedza marara anodhura, uye kukupa mukwikwidzi mukuru mumusika.
Chii chinonzi ic package uye nei encapsulation ine basa muindasitiri yesemiconductor?
Pakati payo, an ic package ndicho chidziviriro chezvombo chinokomberedza chimedu chisina kusimba chesilicon. Pasina iyi yakakosha yekudzivirira layer, iyo yakashama chip yaizokundwa pakarepo nenjodzi dzezvakatipoteredza senge unyoro, guruva, uye kukanganiswa kwemuviri. Chinangwa chekutanga che encapsulation ndeyekusimbisa zvachose zvimiro zvemukati zvakapfava kubva kunze kwenyika. Izvi zvinovimbisa kuti chikamu chichashanda zvakavimbika kwemakore, chingave chakaiswa mukamuri inodzorwa nemamiriro ekunze kana pasi pehodhi yemotokari inodedera.
Munyika yose semiconductor industry, iyo imba yemuviri inoshandawo sezambuko rakakosha. Iyo inoshandura iyo microscopic yekubatanidza mapoinzi pasilicon kuita yakakura, yakamisikidzwa tsoka inogona kunyatso tengeswa pa pcb (yakadhindwa redunhu bhodhi). Izvi zvinoreva vakasarudzwa package type inotaura zvakananga kuti chikamu chinobatanidzwa sei muchigadzirwa chekupedzisira. Imba isina kusarudzwa zvakanaka inogona kutungamira mukupisa, kuderedzwa kwechiratidzo, kana kutadza kwemuchina panguva yekushanda kwakajairwa.
The kugadzira michina kuseri kwemaitiro aya kunoshamisa. Tiri kutora chinhu chisina kusimba segoko rezai tochiisa mumatombo akaomarara. Nhasi, zvikamu zvakajairika zvaunoona pabhodhi ndizvo pamusoro pegomo zvishandiso. Kana kubata ne simple smd chikamu kana yakaoma multi-core processor, iyo chaiyo musimboti unoshanda: iyo goko rekunze rinofanira kunge rakakwana.
Maitiro ekurongedza anodzivirira sei iyo yakatetepa chip kubva mukukuvadzwa?
Rwendo kubva pachimedu chisina chinhu chesilicon kuenda kune chakapedzwa, chinotakurika chigadzirwa chakaoma zvakanyanya. Zvemazuvano kugadzira nzira inoshandisa nzira dzakasiyana-siyana dzakaoma kuti ive nechokwadi chekuvimbika kwakakwana. Imwe yeanonyanya kukosha kurongedza maitiro kunosanganisira kumisikidza kubatanidza kwemagetsi kusati kwaiswa chisimbiso chekupedzisira. Somuenzaniso, mune advanced flip-chip musangano, iyo inoshanda nzvimbo yesilicon inopepetwa kumusoro. Inobatanidza zvakananga kune chimiro chepasi uchishandisa zviduku zvesimbi.
Izvi zvakananga pafiripi chip nzira inoderedza zvakanyanya chinhambwe chinofanira kufamba chiratidzo chemagetsi. Inopa hutano hwakanaka hwemagetsi. Zvisinei, izvi microscopic solder mapundu anoda kudzivirirwa kukuru. Kamwe iyo interconnection yakaitwa zvinobudirira, ungano yose inofanira kuvharwa zvakachengeteka panzvimbo. Iyo inodzivirira inoyerera yakatenderedza aya majoini madiki, ichipa yakasimba mechanical rutsigiro uye kudzivirira kubva pakutsemuka nekushushikana.
Kuwana iyi nhanho yekurongeka kunoda zvinoshamisa chaizvo zvekushandisa zvemuviri. Masimbi esimbi anoshandiswa kugadzira ganda rekupedzisira rekudzivirira anofanirwa kugadzirwa kuti akwanise kushivirira. Pakugadzira zviumbwa izvi zvinorema zvesimbi, vagadziri vemidziyo vanovimba nepamusoro-soroCarbide Drills kucheka zvakachena zvigero zvekutonhodza uye majekiseni ezvikepe pasina kusiya mabhura anogona kukanganisa kuyerera kwemvura yemapurasitiki anodzivirira.
Chii chinonzi epoxy mold compound uye nei ichishandiswa zvakanyanya?
Kana tichitaura nezve dema repurasitiki muviri weyakajairwa microchip, isu tinenge tichingogara tichitaura nezve epoxy mold. Nyaya iyi ndeye specialized thermoset plastiki. Kusiyana nemapurasitiki emazuva ese anogona kunyungudutswa uye kuumbwa patsva, thermoset inosangana nekemikari isingachinjiki kana ichipisa. Kana yangopora, inoumba goko rakaoma kwazvo, rinogara, uye risingaperi.
An epoxy mold compound (inowanzo kunzi emc) ijoka remakemikari rakagadzirwa zvakanyanya. Iyo ine base epoxy resin, inoomesa maajenti, uye huwandu hukuru hwesilica filler. Iyo silica yakakosha nekuti inodzikisira zvakanyanya chiyero chekuwedzera kwezvinhu kana chaiswa pakupisa. Izvi emcs inomiririra mhedziso yemusana wemazuva ano plastiki chikamu dzimba. The zvinhu zvakashandiswa inofanirawo kuva yakanakisa dielectric zvivakwa, kuve nechokwadi kuti vanoita seyakakwana magetsi insulators kudzivirira mukati mapfupi maseketi.
"Kuenderana kwako kuumba zvinhu zvinoraira zvakananga kuenderana kwechigadzirwa chako chekupedzisira. Mukugadzirwa kwepamusoro-soro, kufanotaura kune pundutso. ”
Ko iyo yekuumba musanganiswa inobatana sei neiyo substrate uye inobatana?
Munguva chaiyo yejekiseni chikamu, inopisa, viscous molding compound inomanikidzwa kupinda mugomba resimbi pasi pekumanikidzwa kukuru. Inofanira kuyerera zvakanaka pamusoro pesilicon yakapfava uye iyo iri pasi substrate. Iyi inzira yechisimba. Kana mafambiro emvura akasadzorwa zvakakwana, mvura inomhanya inokwanisa kutsvaira tambo diki dzegoridhe dzinoumba interconnect.
Uyezve, mvura yacho inofanira kuzadza zvachose imwe microscopic mhango mukati me mold. Mhepo ipi neipi yakavharirwa inoita kuti pave pasina. Kusara kamwe chete kunoonekwa senjodzi kuremara. Kana hunyoro hukaungana mukati mechinhu chisina chinhu, kupisa kwehovhoni yakajairwa reflow soldering kunoshandura hunyoro ihwohwo kuita hutsi, huchipeperetsa chikamu chakasiyana nemukati (chinozivikanwa se "popcorn effect").
Kudzivirira izvi, the interface pakati pepurasitiki inodzivirira uye simbi inotungamira furemu inofanirwa kuve yakasimba mumakemikari. Zvakakodzera substrate dhizaini inoita basa guru pano. Mainjiniya anowanzo gadzira anopindirana maficha emuviri kana kushandisa akasarudzika emakemikari adhesion vanokurudzira kuti ive nechokwadi chekuti plastiki inobata simbi zvisina mhosva.
Chimedu chinoita basa rei risati rasanganiswa?
Nhoroondo, silicon yakatemwa kuita zvidimbu zvega isati yaiswa. Zvisinei, kuti kuwedzere kushanda zvakanaka uye optimize iyo tsoka, iyo indasitiri yakagadziridzwa wafer-level kurongedza. Mune iyi nzira yepamusoro, iyo yese yakatenderedza silicon disc inogadziriswa uye yakavharwa panguva imwe chete kusati kwaitwa chero kucheka.
Munguva iyi, chigadziko chekudzivirira chinovhara nzvimbo yose yepamusoro ye disc isina kuputsika. Chete mushure mekunge chidziviriro chekudzivirira chapora zvakakwana chinoita maitiro e singulation kutanga. Singulation inzira yehutsinye yekuchekerera dhisiki hombe, rakavharwa kuita zviuru zvemunhu, zvikamu zvekupedzisira.
Iyi nzira yekucheka inonyanya kuoma nekuti blade yesaha inofanirwa kucheka nepakati peiyo yakaoma silicon uye abrasive silica-yakazadzwa epurasitiki panguva imwe chete. Zvinoda zvinoshamisa zvakaoma uye zvakagadzikana zvekucheka maturusi. Sezvinongoita machinist anoshandisa nyanzvi Yakasimba Tungsten Carbide Tsvimbo kuti ushingirire kupfeka zvinoshatisa paCNC pasi, mablades edicing anofanirwa kushingirira kukweshana kwakanyanya kudzivirira kuchekerera mipendero yakatetepa yezvichangobva kuumbwa.
Masisitimu akaita sei seLPKF kutyaira laser kugadzirisa uye kugadzira kumberi?
Sekuda kwekunyanyisa miniaturization inokura, echinyakare machira ekucheka masaha arikusvika iwo iwo mhedziso yemuviri miganhu. Paunenge uchivaka zvinhu zve smartwatches kana ma implants ekurapa, blade yemuchina yakangokora uye yakaoma. Apa ndipo pane advanced laser masisitimu, seaya akapayona nawo lpkf, pinda mukati kuti uchinje mafambiro ebasa.
Laser processing zvino chikamu chinokosha chemazuva ano kugadzira. Panzvimbo pekukuya kuburikidza nezvinhu, high-powered lasers pakarepo vaporize iyo epoxy mold compound uye nesilicon pasi payo. Iyi yakachena ablation process inosiya mipendero yakatsetseka uye inobvumira nzvimbo yakasimba pakati pezvikamu pamutsara wekugadzira.
Ichi chikuru kufambira mberi zvinoreva kuti zvivakwa zvinogona kuchekwa nekuumbwa nemazvo mashoma µm (micrometers). Nekubatanidza advanced laser ablation neyechinyakare lithography, vagadziri vanogona kugadzira mapasuru akaomarara, ane mativi matatu akanga asingabviri kugadzirwa makore gumi apfuura.
Nei vias uye nzira yepamberi yakakosha kune yakakwira-density ICs?
Vagadziri vemazuva ano havangori masikweya akafuratirwa chete; iwo akaoma, akawanda-layered skyscrapers yedata. Sezvo isu tichirongedza mamwe mabasa munzvimbo imwechete, iyo routing yemagetsi masaini inova monumental geometric dambudziko. Nzira dzemukati dzinofanirwa kunge dziri pfupi pfupi kuti dzichengetedze kumhanya uye kuderedza kushandiswa kwesimba.
Kuti izvi zviitike, mainjiniya anoshandisa maburi madiki, akacherwa akachinjika anonzi vias. Aya madiki tunnels akaputirwa ne conductive simbi, kazhinji cu (mhangura), kubatanidza zvikamu zvakasiyana zve substrate kana zvemukati redistribution layer. The rdl iine microscopic highway system inodzoreredza iyo yekupedzisira-yakanaka kubatanidza pasilicon inofa kune akakura solder mabhora ari kunze.
Izvi high-density marongerwo chinhu chinodiwa chose pakombiyuta yemazuva ano. Dzimwe nguva, echinyakare subtractive etching haigone kuwana inodiwa mitsetse yakanaka. Muzviitiko izvi, additive maitiro ekugadzira anoshandiswa kugadzira zvishoma nezvishoma iwo chaiwo maronda emhangura anodiwa.
- Higher Pin Counts: Mamwe machipi akaomarara anoda mamwe kubatanidza.
- Nzira Dfupi dzeChiratidzo: Vertical connections inoderedza zvakanyanya kunonoka kwechiratidzo.
- Yakaderedzwa Footprint: Layering inobvumira madiki ese echishandiso saizi.
Ndeapi matambudziko nekuwedzera kwekupisa uye warpage panguva yekuumbwa?
Kupisa ndiye muvengi wekupedzisira wekugadzira chaiyo. Munguva yepamusoro-yekushisa yekurapa chikamu, zvese zvigadzirwa zvinowedzera. Dambudziko rakakomba rinomuka nekuti kune hombe mismatch mu kuwedzera kwekushisa mitengo pakati peiyo yakachena silicon inofa, iyo yemhangura inotungamira furemu, uye ganda repurasitiki.
Isu tinoyera uku kuwedzera tichishandisa iyo coefficient yekuwedzera kwemafuta (kana cte) Kana iyo CTE isinganyatso kuenzana, gungano rose rinoputika sezvainotonhora kusvika kune tembiricha yekamuri. Rinokotama sembatatisi chip. Izvi warpage idambudziko remusangano webhodhi. Kana chikamu chacho chisina kukwana zvakakwana, iyo solder joint zvichakundikana panguva smt (pamusoro-soro tekinoroji) yekunamatira maitiro.
Kurwisa izvi, mainjiniya anoshandisa zvakaomarara design tool software yekutevedzera kushushikana kwekupisa pamberi pemuviri muenzaniso inogara ichivakwa. Ivo vanonyatsogadzirisa iyo silica filler yemukati mune epoxy mold kuve nechokwadi kuti CTE yayo inonyatsoenderana neiyo yepasi pebhodhi. Icho chiitiko chakapfava chekuenzanisa chechemistry uye fizikisi.
Standard packaging matekiniki haakwane zvachose kune zvakanyanyisa zvinodiwa zve 5g kutaurirana uye advanced radar masisitimu. Pane idzi ultra-high frequencies, imba yacho pachayo inogona kukanganisa zvakanyanya masaini eredhiyo. Tinofanira kuramba tichitevera kuvandudzwa kwekuita nekushandisa zvinhu zvakasiyana.
Nokuti a high-frequency sensor kana antenna, the zvinhu zvemagetsi ye molding compound vanoongororwa zvakanyanya. Kana iyo zvinhu zvikatora yakawandisa simba remagetsi, chiratidzo chinofa. Naizvozvo, akasarudzika akaderera-kurasikirwa resin anogadzirwa zvakananga kuti aya masaini ekumhanya-mhanya apfuure pasina kushatisa.
Uyezve, tinoona kuwedzera kweiyo advanced ic zvivakwa. Mafungiro akadai heterogenous kusangana uye package-pa-package bvumira zvinhu zvakasiyana-siyana-senge ndangariro uye kugadzirisa logic-kuti zvimisikirwe zvakadzika. Izvi zvinochengeta nzira dzechiratidzo dzakapfupika, zvichiwedzera zvakanyanya kushanda kwemagetsi uye kupisa. Kana iko kurongeka kwakakosha, kushandisa emhando yepamusoro midziyo senge aTriple-Blade (3-Flute) End Mill inova nechokwadi chekuti ma test fixtures akabata aya ma-high-kumhanya maturusi akarembera uye echokwadi.
Iyo yakasimba polymer thermoset inogona kudzivirira kukora uye kukanganisa?
Zvamazvirokwazvo. Kudzivirirwa kwekutanga kunopesana nehutsinye hwechokwadi chenyika yenyama kuvimbika kwe polymer shell. Kana iri nyore discrete simba transistor kana yakanyanya kuoma quad flat hapana-lead (qfn) microcontroller, chinangwa chekupedzisira ndeye zero mwando ingress. Upfu hwemvura ndiyo inokonzera kukonzera mukati ngura uye kukundikana nguva isati yakwana mumagetsi akaiswa.
Kuti uwane ichi chisimbiso chakakwana mukati kugadzirwa kwepamusoro-soro, vagadziri vanosarudza nzira dzakasiyana-siyana zvichienderana nekuoma zvinodiwa pakushandisa. Mvura yekuumba inogona kushandiswa kune dzakatetepa, dzakatetepa maassemblies uko kushomeka kwejekiseni kunosungirwa kudzivirira kutsvaira kwewaya. Zvakasiyana, zvakasimba compression kuumba inowanzosarurwa kune akakura, akafuratira mapaneru nekuti inopa yakanakisa kufanana uye yakakwirira throughput.
Nhanho imwe neimwe mu kugadzira uye kugadzira chikamu chinoda yakasimba methodology. Pane nguva dzose a tradeoff pakati pemutengo, kukurumidza, uye kuvimbika kwakakwana. Nekudaro, nekuda kuomesesa zvinhu zvidzore uye kushandisa mhinduro itsva, indasitiri inoramba ichigadzira mabhiriyoni emidziyo isina kukanganisa gore negore. The kukodzera zvezvinhu inoshandiswa mu ic kugadzirwa kunozogadzirisa hupenyu hwetekinoroji yatinovimba nayo zuva nezuva.
Pfupiso Yezvakakosha zvekutora:
- The ic package inopa kuchengetedzwa kwemuviri kwakakosha uye nzira yakakosha yemagetsi kune iyo isina kusimba silicon.
- Epoxy mold compound inoshanda seyokutanga kudzivirira kubva mukunyorova, kuvhunduka, uye mukati ngura.
- Advanced kurongedza maitiro zvinoda pristine interconnect kuvimbika kuve nechokwadi chakasimba zvinhu zvemagetsi.
- Managing the kuwedzera kwekushisa (cte) yakakosha kudzivirira warpage uye chengetedza zvakakwana smt bhodhi mounting.
- Kutsvaga kwe kushanda kwepamusoro mu 5g maapplication anotsamira zvachose pakugadzirisa ese ari maviri package design uye chaiyo kuumba chemistry.
- Kubudirira kusangana uye kuedza zvinoenderana nechaiyo tooling, yakasimba fluid dynamic control, uye advanced ic teknolojia.
- Kubva pachivanhu pafiripi chip madhizaini kune zvemazuva ano heterogenous stacking, iyo versatility ye Package performance inofambisa iyo tech indasitiri yese mberi.
- A semiconductor haigone kushanda munyika chaiyo pasina yakanyatsogadzirwa, yakagadzikana inodziya plastiki housing.
