
| Sehemu | Kazi | Vipimo vya Kawaida |
|---|---|---|
| Mwili wa bomba | Inasambaza torque, inatoa baridi, huondoa chips | OD: 16–300 mm, Unene wa Ukuta: 3–20 mm, Urefu: 1–6 m |
| Kuunganisha Thread | Huunganisha kwa kichwa/kishika zana kinachochosha | Mazungumzo ya moja/za nyingi (k.m., 4ST/1ST), usahihi wa daraja la 6g, unaooana na viwango vya ISCAR/UNISIG |
| Pedi za Mwongozo | Inahakikisha unyoofu na kumaliza uso | Viingilio vya CARBIDE ya Tungsten, Upana: 5-15 mm, Uwazi na shimo: 0.01-0.03 mm |
| Nyenzo | Inahakikisha rigidity na upinzani kuvaa | Aloi Steel (4140/4340), Nitrided/Chrome-plated uso, Ugumu: HRC 30–45 |
| Kitengo cha Parameta | Mrija Mmoja (STS) | Double Tube (Ejector) | Maoni |
|---|---|---|---|
| Kipenyo cha shimo kinachofaa | 12-850 mm | 18-250 mm | Sekta mbalimbali |
| Uwiano wa Kina Unaopendekezwa | ≤ 200:1 | ≤ 100:1 | Rekebisha kulingana na uthabiti wa mashine na mfumo wa kupoeza |
| Shinikizo la Kupoa | MPa 5-20 | MPa 3–10 | Inahakikisha kusimamishwa kwa chip wakati wa uhamishaji |
| Kiwango cha mtiririko wa baridi | 50–800 L/dak | 30–500 L/dak | Huongezeka kwa kipenyo cha shimo na kina |
| Unyoofu wa bomba | ≤ 0.02 mm/m | ≤ 0.03 mm/m | Muhimu kwa usawa wa shimo na silinda |
| Ukali wa Uso | Kitambulisho Ra ≤ 1.6 μm | Kitambulisho Ra ≤ 3.2 μm | Hupunguza hatari ya kuziba kwa chip |
| Usahihi wa Muunganisho | Uzi Kukatika ≤ 0.01 mm | Sawa na Kushoto | Inahakikisha umakini na usawa unaobadilika |
| Kipenyo cha shimo kinachofaa (mm) | Boring Tube OD (mm) | Kitambulisho cha Boring Tube (mm) | Urefu Unaopendekezwa (m) |
|---|---|---|---|
| 20-30 | 19.05 | 15.00 | 1.5 |
| 31–40 | 28.58 | 22.00 | 2.0 |
| 41–50 | 38.10 | 30.00 | 3.0 |
| 51–65 | 50.80 | 42.00 | 4.0 |