Uchitha amawaka eeyure kunye nezigidi zeedola uyila ulwakhiwo lwesilicon engenasiphako, kodwa ukuba indlu ebonakalayo iyasilela, yonke into ayinaxabiso. Umqobo phakathi kobuchopho be-elektroniki obusebenzayo kunye neqhekeza le-silicon ekhutshiweyo yi-encapsulation. Esi sikhokelo sibanzi siqhekeza ihlabathi elintsonkothileyo lokupakishwa kwe-elektroniki yale mihla. Kufanelekile ukufunda kuba ukuqonda izinto ezithile, amandla obushushu, kunye noxinzelelo lomatshini olubandakanyeka ekukhuseleni isilicon kuya kuphucula kakhulu imveliso yakho. Nokuba ulawula umgca wokudityanisa wevolumu ephezulu okanye ukhangela izixhobo ezichanekileyo zomatshini wokubumba ngokwazo, ukubamba kakuhle ezi ngqikelelo zisisiseko kuya kongela ixesha, kunciphise inkunkuma ebiza imali eninzi, kwaye kukunike ukhuphiswano olukhulu kwimarike.
Yintoni iphakheji ye-ic kwaye kutheni i-encapsulation ibalulekile kwishishini le-semiconductor?
Embindini wayo, i iphakheji ic sisikrweqe esikhuselayo esirhangqe intwana eethe-ethe yesilicon. Ngaphandle kolu maleko olukhuselekileyo olukhuselayo, olungenanto itshiphu inganikezela ngoko nangoko kwiingozi zendalo ezifana nokufuma, uthuli, kunye nefuthe lomzimba. Injongo ephambili ye i-encapsulation kukutywina ngokupheleleyo izinto zangaphakathi eziethe-ethe ezivela kwihlabathi langaphandle. Oku kuqinisekisa ukuba icandelo liya kusebenza ngokuthembekileyo iminyaka, nokuba lifakwe kwigumbi leseva elilawulwa yimozulu okanye phantsi kovalo lwemoto engcangcazelayo.
Kwihlabathi jikelele ishishini lesemiconductor, izindlu ezibonakalayo zikwasebenza njengebhulorho ebalulekileyo. Iguqula iindawo zoqhagamshelo lwemicroscopic kwisilicon ibe yinkulwana, inyawo emgangathweni enokuthi ngenene ithengiswe kwi pcb (ibhodi yesekethe eprintiweyo). Oku kuthetha abakhethiweyo uhlobo lwephakheji iyalela ngokuthe ngqo ukuba icandelo lidibana njani nemveliso yokugqibela. Izindlu ezikhethwe kakubi zingakhokelela ekugqithiseni, ukuthotywa komqondiso, okanye ukungaphumeleli komatshini ngexesha lokusebenza okuqhelekileyo.
I iteknoloji yokuvelisa emva kwale nkqubo iyamangalisa. Sithatha into eethe-ethe njengeqokobhe leqanda kwaye siyigqume kwizinto ezenziwe ngamatye. Namhlanje, ezona nxalenye zixhaphakileyo uzibona ebhodini phezulu phezulu izixhobo. Nokuba ujongana nelula smd iprosesa okanye iprosesa enzima ye-multi-core, umgaqo ofanayo uyasebenza: iqokobhe langaphandle kufuneka ligqibelele ngokupheleleyo.
Iinkqubo zokupakisha zikhusela njani i-chip ethambileyo kumonakalo?
Uhambo olusuka kwisiqwenga esingenanto se-silicon ukuya kwimveliso egqityiweyo, enokunyuka inzima kakhulu. Eyangoku inkqubo yokuvelisa usebenzisa iindlela ezahlukeneyo zobuchule bokuqinisekisa ukuthembeka ngokupheleleyo. Enye yezona zibalulekileyo iinkqubo zokupakisha kubandakanya ukuseka ukudityaniswa kombane phambi kokuba ukutywinwa kokugqibela kwenzeke. Ngokomzekelo, kwi-Advanced indibano ye-flip-chip, indawo esebenzayo ye-silicon ijikelezwe phezulu. Idibanisa ngokuthe ngqo kwisakhiwo esingaphantsi sisebenzisa amaqhuma amancinci amancinci.
Le ngqo flip chip indlela inciphisa kakhulu umgama ekufuneka uhanjwe ngumqondiso wombane. Inika ukusebenza kakuhle kombane. Noko ke, ezi microscopic solder amaqhuma afuna ukhuseleko olukhulu. Kanye i uqhagamshelwano yenziwe ngempumelelo, yonke indibano kufuneka itshixwe ngokukhuselekileyo endaweni yayo. Izinto ezikhuselayo zijikeleza ezi zidibaniselwano ezincinci, zibonelela ngenkxaso eqinile yomatshini kunye nokuthintela ukuqhekeka phantsi koxinzelelo.
Ukufezekisa eli nqanaba lokuchaneka kufuna izixhobo ezichanekileyo ezichanekileyo. Iimbumba zentsimbi ezisetyenziselwa ukubumba iqokobhe lokugqibela lokukhusela kufuneka zenziwe ngoomatshini ukuze zikwazi ukunyamezela. Xa besenza ezi zibumba zentsimbi ezinzima, abenzi bezixhobo baxhomekeke ekusebenzeni okuphezuluCarbide Drills ukusika ngokucocekileyo iziteshi zokupholisa kunye ne-injector port ngaphandle kokushiya i-burrs enokuphazamisa ukuhamba kwamanzi kwiiplastiki ezikhuselayo.
Yintoni i-epoxy mold compound kwaye kutheni isetyenziswa ngokubanzi?
Xa sithetha ngomzimba weplastiki emnyama ye-microchip eqhelekileyo, sihlala sithetha nge- epoxy ngundo. Esi sixhobo sikhethekileyo thermoset iplastiki. Ngokungafaniyo neeplastiki zemihla ngemihla ezinokuthi zinyibilike kwaye zenziwe ngokutsha, i-thermoset ifumana ukuphendulwa kweekhemikhali ezingenakuguqulwa xa ishushu. Nje ukuba linyange, lenze iqokobhe eliqine ngendlela emangalisayo, elihlala ixesha elide, nelisisigxina.
An i-epoxy mold compound (edla ngokubizwa ngokuba emc) yeyona cocktail yekhemikhali eyenziwe ngobunjineli. Iqulethe isiseko se-epoxy resin, ii-ejenti zokuqina, kunye nezixa ezikhulu ze-silica filler. I-silica ibalulekile kuba ithoba kakhulu isantya sokwandiswa kwesixhobo xa ibonakaliswe kubushushu. Ezi emcs imele umqolo opheleleyo wale mihla iplastiki izindlu zecandelo. I izinto ezisetyenzisiweyo kufuneka nayo ibe nencasa idielectric iipropathi, ziqinisekisa ukuba zisebenza njengezithinteli zombane ezigqibeleleyo zokuthintela iisekethe ezimfutshane zangaphakathi.
"Ukuhambelana kwakho ukubumba imathiriyeli iyalela ngokuthe ngqo ukuhambelana kwemveliso yakho yokugqibela. Kwimveliso ephezulu, ukuqikelelwa yinzuzo. ”
Njani ujongano olubumbayo lwekhompawundi kunye nesubstrate kunye nokudibanisa?
Ngexesha lelona nqanaba lokutofa, i-hot, viscous ikhompawundi yokubumba unyanzelwa kumngxuma wentsimbi phantsi koxinzelelo olukhulu. Kufuneka ihambe kakuhle phezu kwe-silicon ethambileyo kunye nezantsi isubstrate. Le yinkqubo yobundlobongela. Ukuba ulwelo oluguquguqukayo alulawulwa ngokugqibeleleyo, ulwelo olubalekayo lunokutshayela ngokoqobo iingcingo ezincinci zegolide ezenza uqhagamshelwano.
Ngapha koko, ulwelo kufuneka luzalise ngokupheleleyo yonke imikroskopu enye umgodi ngaphakathi kokungunda. Nawuphi na umoya ovalelweyo udala isithuba. Isithuba esinye sigqalwa njengentlekele isiphene. Ukuba ukufuma kuqokelelana ngaphakathi kwesithuba esingenanto, ubushushu be-oven yokuphinda buphinde buphinde bujike bube ngumphunga, buvuthela ngokoqobo inxalenye engaphandle (eyaziwa ngokuba yi "popcorn effect").
Ukuthintela oku, i ujongano phakathi kweplastiki ekhuselayo kunye nesakhelo sokukhokela sesinyithi kufuneka somelele ngokwekhemikhali. Ngokufanelekileyo uyilo lwesubstrate idlala indima enkulu apha. Iinjineli zihlala ziyila izinto ezidityanisiweyo zomzimba okanye zisebenzisa abakhuthazi bokubambelela kwiikhemikhali ezikhethekileyo ukuqinisekisa ukuba iplastiki ibamba isinyithi ngokungenasiphako.
Yeyiphi indima edlalwa sisilutyana phambi kokunqunyulwa?
Ngokwembali, i-silicon yayicatshulwe yaziingceba ngabanye ngaphambi kokuba ipakishwe. Nangona kunjalo, ukwandisa ukusebenza kakuhle kunye lungiselela unyawo, ushishino luphuhlisiwe iqhekezana lesonka-inqanaba lokupakisha. Kule ndlela yokuqhubela phambili, yonke idiski ye-silicon ejikelezayo iyacutshungulwa kwaye itywinwe ngaxeshanye ngaphambi kokuba kunqunyulwe nakuphi na ukusika.
Ngeli nqanaba, uluhlu lwezinto ezikhuselayo lugubungela yonke indawo ephezulu yediski engapheliyo. Kuphela emva kokuba umaleko okhuselayo uphilise ngokupheleleyo inkqubo ye ukutyunyuzwa qala. I-Singulation yinkqubo ekhohlakeleyo yomatshini yokusika idiski enkulu, etywiniweyo ibe ngamawaka eenxalenye zokugqibela.
Le nkqubo yokusika idume ngokuba nzima ngenxa yokuba i-saw blade kufuneka inqumle zombini i-silicon enzima kunye ne-abrasive silica-egcwele iplastiki ngaxeshanye. Ifuna izixhobo zokusika ezilukhuni ngokumangalisayo nezizinzileyo. Kanye njengokuba umachini esebenzisa iingcali Iintonga ze-Tungsten Carbide eziqinileyo ukunyamezela ukunxitywa kwe-abrasive kumgangatho we-CNC, ii-dicing blades kufuneka zimelane nokukhuhlana okugqithisileyo ukuthintela ukutshiza imiphetho ethambileyo yamacandelo asanda kwenziwa.
Iinkqubo ezifana ne-LPKF ziqhuba njani ukusetyenzwa kwe-laser kunye nokwenziwa phambili?
Njengemfuno egqithisileyo ukwenziwa kweminiaturization iyakhula, iisarha zokusika oomatshini bemveli zifikelela kwimida yazo yomzimba ngokupheleleyo. Xa usakha amacandelo e-smartwatches okanye ukufakelwa kwezonyango, i-blade yoomatshini inzima kakhulu kwaye irhabaxa kakhulu. Apha kulapho iinkqubo zelaser eziphucukileyo, ezifana nezo ziqalwa ngoovulindlela lpkf, ungene ukuze uguqule indlela yokusebenza.
Ukusetyenzwa kweLaser ngoku iyinxalenye ebalulekileyo yale mihla ukwenziwa. Endaweni yokugaya ngezinto eziphathekayo, iilaser ezine-high-powered lasers ngoko nangoko zinyusa umphunga i-epoxy mold compound kunye nesilicon phantsi kwayo. Le nkqubo yokukhutshwa kwamanzi icocekile ishiya imiphetho egudileyo ngokumangalisayo kwaye ivumela isithuba esiqina kakhulu phakathi kwamalungu kumgca wemveliso.
Oku kukhulu ukuqhubela phambili kuthetha ukuba izakhiwo zinokusikwa kwaye zibunjwe ngokuchanekileyo nje ezimbalwa µm (iimicrometers). Ngokudibanisa i-laser ablation ephezulu kunye nemveli i-lithography, abavelisi banokwenza iimilo zepakethe ezintsonkothileyo ezinokwakheka kuka ntathu ebekungenakwenzeka ukuba zenziwe kwiminyaka elishumi eyadlulayo.
Kutheni le nto i-Vis kunye neendlela eziphambili zibalulekile kwii-ICs ezinoxinano oluphezulu?
Iiprosesa zanamhlanje azikho nje izikwere ezisicaba; zintsonkothile, zinemigangatho emininzi yedatha. Njengoko sipakisha imisebenzi emininzi kwindawo enye, i indlela yemiqondiso yombane iba ngumngeni omkhulu wejometri. Iindlela zangaphakathi kufuneka zibemfutshane ngokumangalisayo ukugcina isantya kunye nokunciphisa ukusetyenziswa kwamandla.
Ukuphumeza oku, iinjineli zisebenzisa imingxunya emincinci, egrunjwa ngokuthe nkqo ebizwa nge. La matonela amancinci afakwe a conductive intsimbi, ngokuqhelekileyo cu (ubhedu), ukudibanisa iileya ezahlukeneyo ze isubstrate okanye yangaphakathi umaleko wokwabiwa ngokutsha. I rdl ngokwesiseko yinkqubo ye-microscopic yendlela yendlela ephinda iphinde iphinde idibane ne-silicon ifele kwiibhola ezinkulu ze-solder ngaphandle.
Oku ukuxinana okuphezulu uyilo luyimfuneko ngokupheleleyo kwikhompuyutha yanamhlanje. Ngamanye amaxesha, i-etching yemveli yokususa ayinakufezekisa imigca emihle efunekayo. Kwezi meko, ukongeza iindlela zokuvelisa zisetyenziselwa ukwakha ngokucothayo imikhondo yobhedu efunekayo.
- Amanani ePin aphezulu: Iichips ezintsonkothileyo ngakumbi zifuna uqhagamshelo olungakumbi.
- Iindlela zoMqondiso eziMfutshane: Uqhagamshelo oluthe nkqo lunciphisa kakhulu ukulibaziseka kophawu.
- Unyawo oluNcitshisiweyo: Ukumaleko kuvumela ubungakanani obuncinci besixhobo.
Yeyiphi imingeni kunye nokwandiswa kwe-thermal kunye ne-warpage ngexesha lokubumba?
Ubushushu lolona tshaba lokwenziwa ngokuchanekileyo. Ngexesha lokunyanga kweqondo eliphezulu, zonke izinto ziyakhula. Ingxaki enkulu ivela ngenxa yokuba kukho ubuninzi ukungafani kwi ukwanda kwe-thermal amaxabiso phakathi kokufa kwesilicon ecocekileyo, isakhelo sobhedu sobhedu, kunye neqokobhe leplastiki.
Silinganisa olu lwandiso ngokusebenzisa i i-coefficient yokwandiswa kwe-thermal (okanye cte). Ukuba i-CTE ayilingani kakuhle, yonke indibano iya kugoba njengoko ipholisa kwiqondo lokushisa. Igoba ngokoqobo njengetshiphu yetapile. Oku iphepha lemfazwe liphupha elibi lendibano yebhodi. Ukuba icandelo alisicaba ngokugqibeleleyo, i i-solder joint iya kusilela ngexesha le smt (iteknoloji yokunyuka komphezulu) inkqubo yokuncamathela.
Ukuphelisa oku, iinjineli zisebenzisa ubugocigoci isixhobo soyilo isoftware yokulinganisa uxinzelelo lobushushu phambi komzimba iprototype ihlala yakhiwe. Bahlengahlengisa ngononophelo umxholo we-silica filler kwi epoxy ngundo ukuqinisekisa ukuba i-CTE yayo ihambelana ngokusondeleyo naleyo yebhodi ephantsi kwayo. Sisenzo esibuthathaka sokulinganisa kwikhemistri kunye nefiziksi.
Iindlela zokupakisha eziqhelekileyo azanelanga ngokupheleleyo kwiimfuno ezigqithisileyo ze 5g unxibelelwano kunye neenkqubo eziphambili zerada. Kwezi frikhwensi ziphezulu kakhulu, indawo yokuhlala ngokwayo inokuphazamisana kakhulu nemiqondiso yerediyo. Kufuneka sisukele singayeki ukusebenza okuphuculweyo ngokusebenzisa imathiriyeli eyodwa.
Kuba high-frequency isivamvo okanye i-eriyali, i iimpawu zombane kwe ikhompawundi yokubumba ziqwalaselwa ngamandla. Ukuba izinto zifunxa kakhulu amandla ombane wombane, umqondiso uyafa. Ke ngoko, iiresin ezikhethekileyo zelahleko ephantsi zenziwe ngokukodwa ukuvumela le miqondiso yesantya esiphezulu ukuba idlule ngaphandle kokuthotywa.
Ngapha koko, sibona ukunyuka kwe phambili ic ulwakhiwo. Concepts ezifana ezahlukeneyo ukudibanisa kunye iphakheji-kwi-package vumela izinto ezahlukeneyo ezikhethekileyo-njengememori kunye nengqiqo yokucubungula-ukuba zipakishwe ngokuthe nkqo. Oku kugcina iindlela zesignali zimfutshane ngokumangalisayo, ziphucula ngokubanzi ukusebenza kombane kunye ne-thermal. Xa ukuchaneka kubalulekile, ukusebenzisa izixhobo ezikumgangatho ophezulu njengeI-Triple-Blade (i-3-Flute) I-End Mill iqinisekisa ukuba izixhobo zovavanyo ezibambe ezi zixhobo zinesantya esiphezulu zithe tyaba ngokugqibeleleyo kwaye ziyinyani.
Ngaba i-thermoset ye-polymer eyomeleleyo iyakuthintela ukubola kunye neziphene?
Ngokuqinisekileyo. Ukhuselo oluphambili ngokuchasene neenyani eziqatha zehlabathi lomzimba kukuthembeka kwe ipholima iqokobhe. Nokuba ilula ecacileyo i-transistor yamandla okanye i-complex kakhulu flat flat akukho- lead (qfn) i-microcontroller, eyona njongo iphambili kukungenwa komswakama. Umphunga wamanzi ngowona nobangela uphambili wangaphakathi umhlwa kunye nokungaphumeleli kwangaphambi kwexesha kwii-electronics ezisetyenzisiweyo.
Ukufezekisa eli tywina ligqibeleleyo kwi imveliso yomthamo ophezulu, abavelisi bakhetha iindlela ezahlukeneyo ngokusekelwe kungqongqo iimfuno zesicelo. Ukubumba ulwelo ingasetyenziselwa ubuthathaka ngendlela emangalisayo, iindibano ezibhityileyo apho uxinzelelo lwenaliti ephantsi lunyanzelekile ukunqanda ukutshayela ucingo. Ngokuchaseneyo, iqinile ucinezelo ukubumba ihlala ikhethwa kwiiphaneli ezinkulu, ezisicaba kuba zibonelela ngokufana okugqwesileyo kunye nokuphuma okuphezulu.
Inyathelo ngalinye kwi uyilo kunye nokwenza isigaba sifuna engqongqo indlela yokusebenza. Kuhlala kukho a urhwebo phakathi kweendleko, isantya, kunye nokuthembeka ngokupheleleyo. Nangona kunjalo, ngokufuna ulawulo olungqongqo lwezixhobo kunye nokusetyenziswa izisombululo ezintsha, eli shishini lisaqhubeka livelisa amawaka ezigidi zezixhobo ezingenasiphako minyaka le. I ukufaneleka zemathiriyeli isetyenziswe kwi-ic Ukwenziwa kwezinto ekugqibeleni kugqiba ubomi betekhnoloji esithembele kuyo yonke imihla.
Isishwankathelo sezinto eziphambili eziThathayo:
- I iphakheji ic ibonelela ngokhuseleko lomzimba olubalulekileyo kunye nendlela yombane ebalulekileyo yesilicon eethe-ethe.
- I-epoxy mold compound isebenza njengokhuselo oluphambili kumanzi, ukothuka, kunye nangaphakathi umhlwa.
- Ikwinqanaba eliphezulu iinkqubo zokupakisha kufuna okucocekileyo uqhagamshelwano imfezeko ukuqinisekisa ukuba womelele iimpawu zombane.
- Ukulawula i ukwanda kwe-thermal (cte) kubalulekile ukuthintela iphepha lemfazwe kwaye uqinisekise ngokugqibeleleyo smt ukufakwa kwebhodi.
- Ukusukela ukusebenza okuphezulu kwi 5g izicelo zixhomekeke ngokupheleleyo ekwandiseni zombini uyilo lwephakheji kunye ngqo ukubumba ikhemistri.
- Iphumelele ukudibanisa kunye novavanyo kuxhomekeke kwisixhobo esichanekileyo, ulawulo olungqongqo lwe-fluid oluguquguqukayo, kunye nokuqhubela phambili iteknoloji ic.
- Ukusuka kwimveli flip chip uyilo lwangoku ezahlukeneyo ukupakisha, i ukuguquguquka kwe ukusebenza kwephakheji iqhubela phambili lonke ishishini letekhnoloji.
- A isemiconductor ayinakusebenza kwihlabathi lokwenyani ngaphandle kobunjineli obugqibeleleyo, obuzinzile ngokushushu iplastiki izindlu.
