Uchitha izinkulungwane zamahora nezigidi zamaRandi uklama ukwakheka kwe-silicon engenasici, kodwa uma izindlu ezibonakalayo zihluleka, yonke ingxenye ayinalutho. Umgoqo phakathi kobuchopho be-elekthronikhi obusebenzayo kanye nocezu lwe-silicon elahliwe yi-encapsulation. Lo mhlahlandlela obanzi wephula umhlaba oyinkimbinkimbi wokupakishwa kwesimanje kwe-elekthronikhi. Kuhle ukufunda ngoba ukuqonda izinto ezithile, amandla okushisa, kanye nokucindezeleka kwemishini okuhilelekile ekuvikeleni i-silicon kuzothuthukisa kakhulu umkhiqizo wakho wokukhiqiza. Kungakhathaliseki ukuthi ulawula ulayini wokuhlanganisa wevolumu ephezulu noma uthola amathuluzi anemba womshini wokubumba ngokwawo, ukwazi kahle le mibono eyisisekelo kuzokongela isikhathi, kunciphise izinsalela ezibizayo, futhi kukunike umphetho omkhulu wokuncintisana emakethe.
Iyini iphakheji ye-ic futhi kungani i-encapsulation ibalulekile embonini ye-semiconductor?
Empeleni, i-an ic iphakethe yisivikelo esizungeza ucezu oluntekenteke lwe-silicon. Ngaphandle kwalolu ungqimba olubalulekile oluvikelayo, olungenalutho chip inganqotshwa ngokushesha ezingozini zemvelo njengomswakama, uthuli, nomthelela womzimba. Umgomo oyinhloko we i-encapsulation ukuvala ngokuphelele izakhiwo zangaphakathi ezithambile ezivela emhlabeni wangaphandle. Lokhu kuqinisekisa ukuthi ingxenye izosebenza ngendlela enokwethenjelwa iminyaka, noma ngabe ifakwe kugumbi leseva elilawulwa yisimo sezulu noma ngaphansi kwehood yemoto edlidlizayo.
Emhlabeni jikelele imboni ye-semiconductor, izindlu ezibonakalayo nazo zisebenza njengebhuloho elibalulekile. Iguqula izindawo zokuxhuma ezincane ku-silicon zibe unyawo olukhudlwana, olumisiwe olungadayiswa ku-a pcb (ibhodi lesifunda eliphrintiwe). Lokhu kusho abakhethiwe uhlobo lwephakheji isho ngokuqondile ukuthi ingxenye ihlangana kanjani nomkhiqizo wokugcina. Izindlu ezikhethwe kabi zingaholela ekushiseni ngokweqile, ekuwohlokeni kwesignali, noma ukwehluleka komshini ngesikhathi sokusebenza okujwayelekile.
I ubuchwepheshe bokukhiqiza ngemuva kwalolu hlelo kuyamangaza. Sithatha into entekenteke njengegobolondo leqanda futhi siyihlanganise ezintweni zokwenziwa eziqinile zamatshe. Namuhla, izingxenye ezivame kakhulu ozibona ebhodini ziyi intaba engaphezulu amadivaysi. Ukuthi usebenzelana nolula smd ingxenye noma i-multi-core processor, isimiso esifanayo siyasebenza: igobolondo langaphandle kufanele liphelele ngokuphelele.
Izinqubo zokupakisha ziyivikela kanjani i-chip ebucayi emonakalweni?
Uhambo olusuka ocezwini olungenalutho lwe-silicon ukuya emkhiqizweni oqediwe, obekezekayo luyinkimbinkimbi kakhulu. Owesimanje inqubo yokukhiqiza isebenzisa amasu ahlukahlukene ayinkimbinkimbi ukuze kuqinisekiswe ukwethembeka okuphelele. Enye yezinto ezibucayi kakhulu izinqubo zokupakisha kuhlanganisa ukusungula ukuxhumana kukagesi ngaphambi kokuvala uphawu kokugcina. Ngokwesibonelo, in advanced ukuhlanganiswa kwe-flip-chip, indawo esebenzayo ye-silicon iphendulwa ibheke phansi. Ixhuma ngqo esakhiweni esingaphansi isebenzisa amaqhubu ensimbi amancane.
Lokhu okuqondile flip chip ukusondela kunciphisa kakhulu ibanga okumele isignali kagesi ilihambe. Inikeza ukusebenza okuhle kakhulu kukagesi. Nokho, lezi microscopic i-solder amaqhubu adinga ukuvikeleka okukhulu. Once the ukuxhumana yenziwe ngempumelelo, yonke inhlangano kufanele ikhiywe ngokuvikelekile endaweni. Izinto ezivikelayo zigeleza zizungeze la malungu amancane, zinikeze ukusekelwa kwemishini okuqinile futhi zivimbele ukuthi zingaqhekeki ngaphansi kwengcindezi.
Ukufinyelela leli zinga lokunemba kudinga ukusebenzisa amathuluzi okungokoqobo okunembe ngendlela emangalisayo. Izibunjwa zensimbi ezisetshenziselwa ukubumba igobolondo lokugcina elivikelayo kufanele zenziwe ngomshini ukuze zikwazi ukubekezelela. Lapho benza lezi zibumba zensimbi ezinzima, abakhi bamathuluzi bathembele ekusebenzeni okuphezuluI-Carbide Drills ukusika ngokuhlanzekile iziteshi zokupholisa nezimbobo zokujova ngaphandle kokushiya ama-burrs angaphazamisa ukugeleza koketshezi lwamapulasitiki okuvikela.
Iyini i-epoxy mold compound futhi kungani isetshenziswa kabanzi?
Uma sikhuluma ngomzimba wepulasitiki omnyama we-microchip evamile, cishe sihlala sikhuluma nge- isikhunta se-epoxy. Lesi sici siyisipesheli i-thermoset ipulasitiki. Ngokungafani namapulasitiki ansuku zonke angancibilika futhi abunjwe kabusha, i-thermoset ibhekana nokusabela kwamakhemikhali okungenakulungiseka lapho ishiswa. Uma seliphulukile, lakha igobolondo eliqine ngendlela emangalisayo, eliqinile, nelihlala njalo.
An i-epoxy mold compound (evame ukubizwa ngokuthi emc) empeleni iyi-cocktail yamakhemikhali eklanywe kakhulu. Iqukethe i-base epoxy resin, ama-ejenti aqinisayo, kanye namanani amakhulu okugcwalisa i-silica. I-silica ibalulekile ngoba yehlisa kakhulu izinga lokunwetshwa kwezinto ezibonakalayo lapho ichayeke ekushiseni. Lezi emcs zimelela umgogodla ophelele wesimanje ipulasitiki ingxenye yezindlu. I izinto ezisetshenziswayo kufanele futhi ibe nenhle kakhulu i-dielectric izakhiwo, ukuqinisekisa ukuthi zisebenza njengama-insulators kagesi aphelele ukuvimbela izifunda ezimfushane zangaphakathi.
“Ukuvumelana kwakho ukubumba impahla isho ngokuqondile ukuvumelana komkhiqizo wakho wokugcina. Ekwenziweni okuphezulu, ukubikezelwa kuyinzuzo. ”
I-interface ehlanganisiwe yokubumba ihlangana kanjani ne-substrate kanye nokuxhumanisa?
Phakathi nesigaba sangempela somjovo, ukushisa, i-viscous inhlanganisela yokubumba uphoqeleka ukuba angene emgodini wensimbi ngaphansi kwengcindezi enkulu. Kumele igeleze ngokushelelayo phezu kwe-silicon ethambile kanye nangaphansi i-substrate. Lena inqubo yodlame. Uma uketshezi olushintshashintshayo lungalawulwa ngokuphelele, uketshezi olugijimayo lungashanela ngokoqobo izintambo ezincane zegolide ezakha ukuxhumana.
Ngaphezu kwalokho, uketshezi kufanele lugcwalise ngokuphelele yonke i-microscopic eyodwa umgodi ngaphakathi kwesikhunta. Noma yimuphi umoya ovaleleke udala isikhala. Isikhala esisodwa sibhekwa njengenhlekelele isici. Uma umswakama unqwabelana phakathi kwesikhala, ukushisa kuhhavini othungathayo ogeleza kabusha ojwayelekile kuzoshintsha lowo mswakamo ube isitimu, kuphephezelisa ingxenye ethile ngaphakathi (okwaziwa ngokuthi “umphumela we-popcorn”).
Ukuvimbela lokhu, i esibonakalayo phakathi kwepulasitiki evikelayo kanye nohlaka lomthofu lwensimbi kumele lube namandla amakhemikhali. Okufanelekile ukwakheka kwe-substrate idlala indima enkulu lapha. Onjiniyela bavame ukuklama izici zomzimba ezixhumene noma basebenzise abagqugquzeli bokunamathela kwamakhemikhali ukuze baqinisekise ukuthi ipulasitiki ibamba insimbi ngokungenasici.
Iyiphi indima edlalwa isinkwa esilucwecwana ngaphambi kokukhonjiswa?
Ngokomlando, i-silicon yayinqunywa ibe yizicucu ngazinye ngaphambi kokuba ihlanganiswe. Nokho, ukukhulisa ukusebenza kahle kanye nokwandisa umkhondo, imboni yathuthukiswa isilucwecwana-izinga lokupakisha. Kule ndlela ethuthukisiwe, yonke i-silicon disc eyindilinga iyacutshungulwa futhi ivalwe kanyekanye ngaphambi kokuthi kunqunywe noma yikuphi.
Phakathi nalesi sigaba, ungqimba lwezinto ezivikelayo luhlanganisa yonke indawo ephezulu yediski engaphukile. Kuphela ngemva kokuba isendlalelo sokuzivikela selaphe ngokuphelele inqubo yoku singulation qala. I-Singulation inqubo enonya yokusika idiski enkulu, evalekile ibe izinkulungwane zezinto ezingazodwana, zokugcina.
Le nqubo yokusika idume kabi ngoba i-saw blade kufanele inqamule kokubili i-silicon eqinile kanye nepulasitiki egcwele i-silica egcwele kanyekanye. Idinga amathuluzi okusika aqine ngendlela emangalisayo futhi azinzile. Njengoba nje umakhi wemishini esebenzisa okukhethekile Izinduku ze-Tungsten Carbide eziqinile ukuze ubekezelele ukuguga okulimazayo esitezi se-CNC, izindwani zokudayela kufanele zimelane nokungqubuzana okukhulu ukuze kuvinjelwe ukuchotshozwa kwemiphetho ebucayi yezingxenye ezisanda kwakhiwa.
Amasistimu afana ne-LPKF aqhuba kanjani ukucutshungulwa kwe-laser nokwenziwa kuya phambili?
Njengoba isidingo ngokwedlulele i-miniaturization iyakhula, amasaha okusika emishini yendabuko afinyelela umkhawulo wawo ophelele womzimba. Lapho wakha izingxenye zamawashi ahlakaniphile noma izimila zezokwelapha, i-mechanical blade imane ijiyile futhi ilukhuni kakhulu. Lapha kulapho amasistimu e-laser athuthukile, njengalawo aqalwa ngawo lpkf, ngena ukuze uguqule indlela yokusebenza.
Ukucutshungulwa kwe-laser manje iyingxenye eyisisekelo yesimanje ukwenziwa. Esikhundleni sokugaya ngokusebenzisa impahla, ama-laser anamandla amakhulu ahwamulisa ngokushesha i-epoxy mold compound kanye ne-silicon ngaphansi kwayo. Le nqubo yokukhishwa kwe-ablation ehlanzekile ishiya imiphetho ebushelelezi ngendlela emangalisayo futhi ivumela isikhala esiqinile phakathi kwezingxenye emugqeni wokukhiqiza.
Lokhu okukhulu intuthuko kusho ukuthi izakhiwo zingasikwa futhi zilolongwe ngokunemba kwezimbalwa nje µm (ama-micrometer). Ngokuhlanganisa i-laser ablation ethuthukisiwe neyendabuko i-lithography, abakhiqizi bangakha izimo zephakheji eziyinkimbinkimbi kakhulu, ezinezinhlangothi ezintathu okwakungenakwenzeka ngokomzimba ukukhiqiza eminyakeni eyishumi edlule.
Kungani i-vias kanye nemizila ethuthukisiwe ibalulekile kuma-IC aminyana kakhulu?
Amaprosesa esimanje awazona nje izikwele eziyisicaba; ziyinkimbinkimbi, amabhilidi anezendlalelo eziningi zedatha. Njengoba sipakisha imisebenzi eminingi endaweni eyodwa, i umzila yezimpawu zikagesi iba inselele enkulu yejometri. Izindlela zangaphakathi kufanele zibe zimfushane ngendlela emangalisayo ukuze kugcinwe isivinini nokunciphisa ukusetshenziswa kwamandla.
Ukuze bafeze lokhu, onjiniyela basebenzisa izimbobo ezincane ezimbozwe zibheke phezulu ezibizwa ngokuthi nge. Le mihubhe emincane igcwele a conductive metal, ngokuvamile cu (ithusi), ukuxhuma izingqimba ezahlukene i-substrate noma okwangaphakathi ungqimba lokusabalalisa kabusha. I rdl iwuhlelo lomgwaqo onguthelawayeka oluncane kakhulu oluhambisa kabusha uxhumo lwe-ultra-fine ku-silicon die kumabhola amakhulu e-solder ngaphandle.
Lokhu ukuminyana okuphezulu isakhiwo siyisidingo esiphelele sekhompuyutha yesimanje. Kwesinye isikhathi, ukuqoshwa kwendabuko kokukhipha akukwazi ukufeza imigqa emihle edingekayo. Kulezi zimo, okungeziwe amasu okukhiqiza asetshenziselwa ukwakha kancane kancane imikhondo yethusi edingekayo.
- Izibalo Zephini Eziphakeme: Ama-chips ayinkimbinkimbi adinga ukuxhumana okwengeziwe.
- Imizila Yesiginali emifushane: Ukuxhumeka okuqondile kunciphisa kakhulu ukubambezeleka kwesignali.
- Izinyathelo Ezincishisiwe: Ukwendlalela kuvumela osayizi bedivayisi abancane bebonke.
Yiziphi izinselele ngokunwetshwa okushisayo kanye ne-warpage ngesikhathi sokubumba?
Ukushisa kuyisitha esikhulu sokukhiqiza okunembayo. Phakathi nesigaba sokuphulukisa sokushisa okuphezulu, zonke izinto zokwakha ziyakhula. Inkinga enkulu iphakama ngoba kukhona okukhulu ukungafani kwe ukwanda okushisayo amanani phakathi kwe-silicon ehlanzekile yokufa, ifreyimu yokuhola yethusi, negobolondo lepulasitiki.
Sikala lokhu kwandiswa kusetshenziswa i- i-coefficient ukunwetshwa kwe-thermal (noma cte). Uma i-CTE ingalingani kahle, yonke inhlangano izosonteka njengoba iphola ifinyelela kuzinga lokushisa legumbi. Ikhothama ngokwezwi nezwi njengecezu lezambane. Lokhu i-warpage kuyiphupho elibi lokuhlangana kwebhodi. Uma ingxenye ingekho flat ngokuphelele, the inhlanganisela ye-solder uzohluleka ngesikhathi smt (ubuchwepheshe bokukhweza phezulu) inqubo yokunamathisela.
Ukuze ugweme lokhu, onjiniyela basebenzisa eyinkimbinkimbi ithuluzi lokuklama isofthiwe yokulingisa izingcindezi ezishisayo ngaphambi komzimba isibonelo iyakhiwa njalo. Balungisa ngokucophelela okuqukethwe kwe-silica filler ku- isikhunta se-epoxy ukuqinisekisa ukuthi i-CTE yayo ifana eduze nebhodi elingaphansi. Kuyisenzo esibucayi sokulinganisa samakhemikhali kanye ne-physics.
Amasu okupakisha ajwayelekile awanele ngokuphelele izidingo ezidlulele ze 5g zokuxhumana kanye nezinhlelo ze-radar ezithuthukisiwe. Kula maza aphakeme kakhulu, indawo yokuhlala ngokwayo ingaphazamisa kakhulu amasignali omsakazo. Kumelwe siphishekele ngokungakhathali ukusebenza okuthuthukisiwe ngokusebenzisa izinto ezikhethekile.
Okwe-a high-frequency inzwa noma uthi, i izakhiwo zikagesi kwe inhlanganisela yokubumba zibhekisiswa kakhulu. Uma okokusebenza kudonsa amandla kazibuthe amaningi kakhulu, isignali iyafa. Ngakho-ke, ama-resin akhethekile alahlekelwa kancane akhiwa ngokuqondile ukuvumela lezi zimpawu zesivinini esikhulu zidlule ngaphandle kokuwohloka.
Ngaphezu kwalokho, sibona ukwanda kwe- advanced ic izakhiwo. Imiqondo efana ezahlukene ukuhlanganiswa kanye iphakheji-phezu kwephakheji vumela izingxenye ezikhethekile ezihlukile—njengenkumbulo nokucubungula ukucabanga—ukuba zipakishwe ziqonde. Lokhu kugcina izindlela zesignali zimfushane ngendlela emangalisayo, okuthuthukisa kakhulu ingqikithi ukusebenza kukagesi nokushisa. Uma ukunemba kubalulekile, kusetshenziswa amathuluzi ekhwalithi ephezulu njenge-aI-Triple-Blade (3-Flute) Umshini Wokugcina iqinisekisa ukuthi izinto zokuhlola eziphethe lawa madivayisi anesivinini esikhulu ayisicaba futhi ayiqiniso.
Ingabe i-thermoset ye-polymer eqinile ingakuvimbela ngempela ukugqwala namaphutha?
Nakanjani. Isivikelo esiyinhloko ngokumelene namaqiniso anonya omhlaba wenyama ubuqotho be i-polymer igobolondo. Kungakhathaliseki ukuthi kulula ezehlukene I-transistor yamandla noma eyinkimbinkimbi kakhulu i-quad flat akukho-lead (qfn) i-microcontroller, inhloso yokugcina ingu-zero umswakama ongena. Umhwamuko wamanzi uyimbangela ehamba phambili yangaphakathi ukugqwala kanye nokwehluleka ngaphambi kwesikhathi kuma-electronics asetshenzisiwe.
Ukuze uthole lolu hlelo lokusebenza oluphelele ukukhiqizwa kwevolumu ephezulu, abakhiqizi bakhetha izindlela ezihlukene ngokusekelwe kokuqinile izidingo zohlelo lokusebenza. Ukubumba uketshezi ingase isetshenziselwe ukuhlanganisa okuntekenteke ngendlela emangalisayo, ezacile lapho ingcindezi yomjovo ephansi iphoqelekile ukuvimbela ukushanela ngocingo. Ngokuphambene, okuqinile ukucindezela ukubumba kuvame ukuncanyelwa amaphaneli amakhulu, ayisicaba ngoba ahlinzeka ngokufana okuhle kakhulu kanye nokuphuma okuphezulu.
Njalo isinyathelo esisodwa ku ukuklama nokukhiqiza isigaba sidinga esiqinile indlela yokwenza. Kukhona njalo a ukuhwebelana phakathi kwezindleko, isivinini, nokwethembeka okuphelele. Nokho, ngokufuna ukulawula okuqinile nokusetshenziswa kwezinto ezibonakalayo izixazululo ezintsha, imboni iyaqhubeka nokukhiqiza izigidigidi zemishini engenasici minyaka yonke. I ukufaneleka wezinto zokwakha esetshenziswa ku-ic ukwakhiwa ekugcineni kunquma ubude bempilo yobuchwepheshe esithembele kubo nsuku zonke.
Isifinyezo Sokuthatha Okubalulekile:
- I ic iphakethe inikeza isivikelo esibalulekile somzimba kanye nemizila kagesi ebalulekile ye-silicon ebuthakathaka.
- I-epoxy mold compound isebenza njengesivikelo esiyinhloko kumswakama, ukushaqeka, nangaphakathi ukugqwala.
- Okuthuthukile izinqubo zokupakisha zidinga ezihlanzekile ukuxhumana ubuqotho ukuqinisekisa ukuqina izakhiwo zikagesi.
- Ukuphatha i ukwanda okushisayo (cte) kubalulekile ukuvimbela i-warpage futhi uqinisekise okuphelele smt ukukhweza ibhodi.
- Ukuphishekela ukusebenza okuphezulu phakathi 5g izinhlelo zokusebenza zincike ngokuphelele ekwandiseni kokubili iphakethe design kanye nokuqondile ukubumba ikhemistri.
- Iphumelele ukuhlanganisa nokuhlola kuncike ekusetshenzisweni kwamathuluzi okunembayo, ekulawuleni okunamandla okuguquguqukayo koketshezi, nokuthuthukisiwe ubuchwepheshe be-ic.
- Kusukela kwendabuko flip chip imiklamo yesimanje ezahlukene stacking, i ukwenza izinto ezihlukahlukene kwe ukusebenza kwephakheji iqhubekisela phambili yonke imboni yezobuchwepheshe.
- A i-semiconductor ayikwazi ukusebenza emhlabeni wangempela ngaphandle kokwakhiwa okuphelele, okuzinzile okushisayo ipulasitiki izindlu.
